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Typical Thermal Characteristics
8
V DS = 5V
3.5
1a
J
6
T = -55°C
3
4
25°C
2.5
2
125°C
1.5
1b
T A = 2 5 C
2
1
1c
4.5"x5" FR-4 Board
o
Still Air
I , DRAIN CURRENT (A)
2oz COPPER MOUNTING PAD AREA (in )
0
0
2
D
4 6
8
10
0.5
0
0.2 0.4 0.6 0.8
2
1
Figure 13. Transconductance Variation with Drain
Current and Temperature.
4
Figure 14. SOT-223 Maximum Steady- State
Power Dissipation versus Copper
Mounting Pad Area.
20
IM
ON
RD
100
3
1a
10
5
1
S(
)L
IT
10
ms
10u
us
s
2
1
1c
1b
4 .5"x5" FR-4 Board
T = 25 o C
A
Still Air
0.5
0.1
0.05
V GS = 4.5V
SINGLE PULSE
R θ JA =See Note1c
T A = 25°C
1s
10s
DC
10
0m
s
0
V
GS
= 4.5V
0.01
0
0.1
0.2 0.3
2
2oz COPPER MOUNTING PAD AREA (in )
0.4
0.5
0.1
0.5
1 2 5 10
V DS , DRAIN-SOURCE VOLTAGE (V)
30
50
80
Figure 15. Maximum Steady- State Drain
Current versus Copper Mounting Pad
Area.
1
Figure 16. Maximum Safe Operating Area .
0.5
D = 0.5
R JA (t) = r(t) * R JA
θ
0.2
0.1
0.05
0.02
0.2
0.1
0.05
0.02
P(pk)
θ θ
R JA = See Note 1 c
0.01
0.01
t 1
t 2
T J - T A = P * R (t)
0.005
0.002
0.001
Single Pulse
θ JA
Duty Cycle, D = t 1 / t 2
0.0001
0.001
0.01
0.1
1
10
100
300
t 1 , TIME (sec)
Figure 17. Typical Transient Thermal Impedance Curve .
Remark: Thermal characterization performed under the conditions of Note 1c. Should better thermal design employs, R θ JA will be
lower and reach thermal equivalent sooner.
NDT014L Rev.D
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